Posts, reposts and quotes from a curated set of X accounts, newest first, each quoted as its author published it. PiggyGPT chooses the accounts; a post appears when it is about the company or its market. None of it is PiggyGPT’s view.
Daily digest
Micron is doubling down on its 6F² DRAM architecture and moving straight to 3D DRAM while rivals adopt 4F², alongside new vHBM and vEIM roadmap targets and a 2027 ramp of 1-delta DRAM and G11 NAND.
AI-generated Oct 22, 2026. Not a source. Verify against the filings.
TheValueist@TheValueist5:49 PM ET
$NOK KEY READ-THROUGHS FROM NOKIA’S Q3 2026 EARNINGS CALL (1/2) Nokia’s call supports a widening AI connectivity investment cycle, but not a broad telecommunications equipment recovery. The strongest positive implications concern optical transport, cloud routing, photonic…
SOUTH KOREAN MEDIA: SK HYNIX CANCELS PLANS TO LIST SOLIDIGM ON NASDAQ; ANNOUNCEMENT EXPECTED SOON https://t.co/RXiiPsyCSt
P Equity Research 📰@pequityresearch3:11 PM ET
Expert Takeaways: Memory > S/D gap of at least 20% in second half of 2026. > Big vendors have just begun forecasting since demand for 2027 has not settled yet. > S/D gap for 2027 is possibly around 10%. A pessimistic take believing in balance by end of next year. $MU $DRAM…
Alex A.C.@AnalysisOp12:05 PM ET
Reposted by @BenBajarin
"Our Core Memory model already has HBM supply-limited from 2029, and it does not yet carry vHBM or vEIM [new Micron products], so our current theory is that the risk to our supply balance skews tighter" 😱🔥🔥 Micron $MU to MUUN 🌛 WHEN RE-RATE! 😤
Quoting @BenBajarin
Note up in Atlas for subscribers and clients post Micron technology webinar. I had time with Scott DeBoer after the call to get some technical clarity as well. Lots of good nuggets of insights here.
[DDR5 16G DRAM Spot Price] Start : 2025-08-01 / $6.167 Latest : 2026-10-22 / $61.100 Daily : +0.38% From ATH: +0.00% Since : +890.76% ATH : 2026-10-22 / $61.100 당연히 ATH https://t.co/KzqLy2JSZZ
Reposted by @trendforce
Rising memory prices and tight foundry capacity boosted #PSMC’s Q3 revenue by 80% YoY and net profit by 338%, with further 10–20% mature-node price hikes planned for 2027.💡More: https://t.co/VFfuobetqo 🔗
Sravan Kundojjala@SKundojjala4:53 AM ET
- ex-China mature foundry/IDM analog/power/MCU spending not yet meaningfully ticking up in CY26; expected to be strong in CY27 - NAND was a record $1.49B, up 52% on the quarter and 133% YoY, and 1.08x the FY23Q2 peak - DRAM was a record $1.15B, up 102% YoY and 1.6x the…
Sravan Kundojjala@SKundojjala4:51 AM ET
- CY27 WFE outlook at >$200B (unusually early per Lam’s standards); likely higher as the year progresses - CY27 rank order of incremental growth: DRAM, leading-edge foundry/logic and NAND; 10 new Tier-1 fabs coming online across CY27 - CY27 still supply constrained (cleanroom…
Sravan Kundojjala@SKundojjala4:48 AM ET
Lam Research QSep26 - Revenue up 22% q/q and 54% y/y to $8.22B at 52.4% GM and 40.2% OPM (ATH) - QDec26 guide at 8.6B(+/-400M ) at52.5% GM and 40.5% OPM - Micron skipping 4F2 in favour of 3D DRAM is a positive thing for Lam, given 3D DRAM is etch and dep intensive (like 3D NAND)…
TrendForce@trendforce4:14 AM ET
#TrendForce notes that #Micron plans to begin mass producing its 1-delta nm process in 2027, which is set to succeed its current mainstream 1-gamma nm process. Beyond this transition, Micron intends to continue scaling its 6F² architecture before moving directly to 3D DRAM,…
Quoting @wccftech
Micron’s DDR6 doubles DDR5 bandwidth while LPDDR6 delivers 35% better power efficiency, both built on its upcoming 1δ DRAM node, vHBM goes vertical, and G11 NAND goes beyond 400 layers. 🔗https://t.co/hPuISi998H https://t.co/V47gaKGi4T
Reposted by @trendforce
#NVIDIA-linked #Groq is reportedly exploring 3D-stacked DRAM for its next-gen AI chips, potentially moving beyond #SRAM as AI models grow larger. Could this reshape AI inference chip design? 💡More: https://t.co/NsxE5uH2cq 🔗
TrendForce@trendforce3:40 AM ET
🔥 #Micron has unleashed a wave of memory roadmap updates, spanning DRAM, HBM and NAND. The standout? Its Vertical 3D HBM (vHBM), now with a 2028 mass-production target.
Quoting @NEWS2082680
While China's #CXMT pushes ahead with 4F² #DRAM, #Micron is taking the opposite path, sticking with 6F² and arguing that cell architecture alone doesn't determine bit density. What’s next on its memory roadmap? 💡More: https://t.co/8Wnb3NGZYT 🔗 https://t.co/Z3x1RFMvjR
While China's #CXMT pushes ahead with 4F² #DRAM, #Micron is taking the opposite path, sticking with 6F² and arguing that cell architecture alone doesn't determine bit density. What’s next on its memory roadmap? 💡More: https://t.co/8Wnb3NGZYT 🔗 https://t.co/Z3x1RFMvjR
Daily digest
Micron averted a larger labor disruption as its Taichung union signed a deal while its smaller Taoyuan union went ahead with a planned 24-hour strike.
AI-generated Oct 21, 2026. Not a source. Verify against the filings.
According to Counterpoint Research, YMTC, like CXMT, is researching DRAM based on a 4F² cell architecture. YMTC’s version operates at 9,600 MT/s and is slated for mass production at YMTC Fab 3. https://t.co/1ZhIbHTT5M
TheValueist@TheValueist8:48 PM ET
$TSLA KEY READ-THROUGHS FROM TESLA’S Q3 2026 EARNINGS CALL Tesla’s October 21 call provides its strongest cross-market signals in battery supply, electrical infrastructure, semiconductor equipment, and autonomous transportation. The central distinction is between growing demand…
Dan Nystedt@dnystedt7:16 PM ET
Powerchip (PSMC) plans to raise prices 10% to 20% next year for mature node chip manufacturing as production lines fill up: Utilization increased to 97% in the 3rd quarter (Q3) from 87% in Q2, media report, adding PSMC is already mulling a new fab with 20,000 to 40,000 wafers…
TheValueist@TheValueist7:00 PM ET
$IBM KEY READ-THROUGHS FROM IBM’S Q3 2026 EARNINGS CALL IBM’s results indicate that enterprise AI spending is expanding beyond model experimentation into application modernization, data infrastructure, security and production deployment. The distribution of economic benefits…
TheValueist@TheValueist6:55 PM ET
PERFORMANCE-TIER NAND OPENS A NEW OPPORTUNITY, BUT EQUIPMENT DEMAND IS CLEARER THAN PRODUCER MARGIN UPSIDE (READ-THROUGH 6) (2/2) Affected companies: Kioxia Holdings (285A: Japan), Sandisk (SNDK: United States), SK hynix (000660: South Korea), and Micron Technology (MU: United…
TheValueist@TheValueist6:55 PM ET
$LRCX KEY READ-THROUGHS FROM LAM RESEARCH’S FISCAL Q1 2027 EARNINGS CALL (1/2) Lam Research’s October 21, 2026 call reinforces a semiconductor investment cycle increasingly constrained by physical capacity rather than customer spending intentions. The preliminary outlook for…
Micron’s DDR6 doubles DDR5 bandwidth while LPDDR6 delivers 35% better power efficiency, both built on its upcoming 1δ DRAM node, vHBM goes vertical, and G11 NAND goes beyond 400 layers. 🔗https://t.co/hPuISi998H https://t.co/V47gaKGi4T
Dan Nystedt@dnystedt6:15 PM ET
Micron Taiwan's smaller union will go on strike today (10/22) for 24-hours as planned as no concrete agreement was reached during late discussions, media report, and despite a labor agreement signed by Micron and the larger union from Taichung. No details of that agreement have…
Ben Bajarin@BenBajarin1:52 PM ET
Note up in Atlas for subscribers and clients post Micron technology webinar. I had time with Scott DeBoer after the call to get some technical clarity as well. Lots of good nuggets of insights here.
Quoting @creativestrat
Our Micron roadmap read: AI memory is becoming a system design problem. More bandwidth only helps if power and capacity keep pace. We examine the architecture and supply implications in our new Atlas note: https://t.co/RQit1YTQ7Y
Creative Strategies, Inc@creativestrat1:30 PM ET
Our Micron roadmap read: AI memory is becoming a system design problem. More bandwidth only helps if power and capacity keep pace. We examine the architecture and supply implications in our new Atlas note: https://t.co/RQit1YTQ7Y
Reposted by @trendforce
#Micron Taiwan's Taoyuan union announced a 24-hour strike from 9 a.m. on Oct. 22 after talks with the #Memory maker ended without agreement; the company said it signed a deal with its Taichung union the same day.💡More: https://t.co/qNVE0nPCn0 🔗 $MU https://t.co/m6mVu8k68u
Ben Bajarin@BenBajarin10:47 AM ET
Memory co-design really is the thing commodity thinking about memory just doesn't comprehend. $MU https://t.co/ao5532WQa4
Ben Bajarin@BenBajarin10:41 AM ET
Per my point earlier, memory roadmaps start to segment to AI class solutions. $MU https://t.co/hvIyopyEqe
Ben Bajarin@BenBajarin10:39 AM ET
$MU let's just jump to G11 from G9. https://t.co/QOPHUrTAdg
Ben Bajarin@BenBajarin10:37 AM ET
This chart is $ Also, hard to see memory not being constrained then through 2030 at they very least. "As these products come in, the trade ratios continue to be stressed in terms of the number of wafers it takes to build HBM, vertical HBM, and vertical EIM relative to building…
Looks like Micron is developing zHBM too. 👀👀 https://t.co/3tL0wuqjg5
Ben Bajarin@BenBajarin10:33 AM ET
exhibit #501 WFE to the moon. "Stacking technology is still key, and ultimately there will be implementations going forward of higher and higher stacks because memory capacity does play a major role in driving token costs down and in system ultimate system optimization" $MU…
Ben Bajarin@BenBajarin10:31 AM ET
HBM is the key memory segment that is co-designed, designed in, and this point is continually misunderstood. Also, vertical HBM 👀 $MU https://t.co/xgQrRLUCwx
Ben Bajarin@BenBajarin10:28 AM ET
DRAM CMOS roadmap.. "Advanced CMOS roadmap to meet AI bandwidth demands" https://t.co/mIkxR7mC1q
Ben Bajarin@BenBajarin10:27 AM ET
The angstrom era for memory is going to be equally has interesting, maybe more, as logic. $MU https://t.co/nGBjxqlpmE
Reposted by @BenBajarin
Hmm... Looks like Micron is going straight to 3D DRAM. https://t.co/PuFm0vAYXM
Ben Bajarin@BenBajarin10:25 AM ET
"not pursuing 4F2 due to increased complexity/cost" Nice sharing of roadmap. $MU https://t.co/3HFdX05BTb
Ben Bajarin@BenBajarin10:22 AM ET
$MU talking memory technology roadmap, where they think they can still scale planar but will have 3D memory when the cost and performance makes sense for the market. https://t.co/lr1PFXkI9p
Ben Bajarin@BenBajarin10:15 AM ET
Memory node shrinks can't stop won't stop lol. $MU https://t.co/nKjuwL44gX
Ben Bajarin@BenBajarin10:11 AM ET
Just an interesting observation as $MU shows off their product milestones. Given memory timelines from chip to market, most of this roadmap was not specifically designed for where AI workloads are going. Will be interesting to see future products and how they are more…
Ben Bajarin@BenBajarin10:06 AM ET
Via $MU webinar the technology cycles we are in, and that are coming, that drive memory demand. Bet on bit growth not history.... https://t.co/6jTxq896L1
Micron got me excited right from the first slide.😭😭 https://t.co/arYOik7Eyq
Reminder: The Micron webinar starts in one minute. https://t.co/4fhYKXZ0a0
Daniel Romero@HyperTechInvest8:25 AM ET
$MU Close to Avoiding Strike in Taiwan Micron has reached an agreement with its Taichung labor union, potentially averting the October 22 strike Starting FY2027, employees will receive quarterly profit-sharing bonuses, with 50% paid in cash and 50% in stock. Union projections…
JPM memory market update https://t.co/gnnDaHRMJA
[DDR5 16G DRAM Spot Price] Start : 2025-08-01 / $6.167 Latest : 2026-10-21 / $60.867 Daily : +0.28% From ATH: +0.00% Since : +886.98% ATH : 2026-10-21 / $60.867 오늘도 ATH https://t.co/7BclIqSk9w
Dan Nystedt@dnystedt4:28 AM ET
Micron Taiwan strike averted? Micron signed a labor agreement with the union for its Taichung operations and cancelled mediation talks set for Thursday (10/22), media report, while the Micron Taoyuan union is meeting to decide on whether or not to call off its 1-day strike set…
TrendForce@trendforce4:20 AM ET
👀 AI demand may be fueling NAND upgrades, but #YMTC is adding pressure. As the Chinese rival closes the technology gap, #Samsung and #SKhynix face a tougher balancing act: keeping their China fabs competitive while navigating U.S. export curbs.
Quoting @NEWS2082680
With roughly 30–40% of their NAND output tied to China, #Samsung and #SKhynix are racing to upgrade local fabs as #YMTC closes in—reportedly producing 294-layer NAND in limited volumes.💡More: https://t.co/zJAjCNXbTy 🔗 https://t.co/BHRMQ51NGS
With roughly 30–40% of their NAND output tied to China, #Samsung and #SKhynix are racing to upgrade local fabs as #YMTC closes in—reportedly producing 294-layer NAND in limited volumes.💡More: https://t.co/zJAjCNXbTy 🔗 https://t.co/BHRMQ51NGS
SK hynix has begun discussions with its supply chain to prepare for adoption and production of "iHBM," a next generation technology designed to reduce heat in HBM, according to Korean media reports. iHBM places thermal control elements (ICE) in the signal interconnect region of…
TrendForce@trendforce2:00 AM ET
【Weak Module-House Demand Weighs on NAND Spot Trading; 512Gb TLC Prices Dip 1.28%】 Due to weak demand from the largest buyer, module houses, combined with persistently high inventory levels, trading volume of the spot market has remained sluggish. Sellers believe that price cuts…
Reposted by @dnystedt
Exclusive: Samsung Electronics and SK Hynix are upgrading their China factories to produce more advanced memory chips, aiming to fend off competition from a fast-growing Chinese rival and meet huge AI demand https://t.co/1bC6hT9vVf